NASA News·· 9 小时前精选推荐指数73.52
TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
TB 26-10 印刷电路板组件片式电阻本体开裂
导读
For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]
NASA 技术简报记录了两起片式电阻在振动后热循环中开裂的案例，失效分析排除了批次缺陷和疲劳，认定电路板弯曲与安装应力是主要诱因。简报据此给出元件布局、焊点高度与热冲击测试等装配建议。
推荐理由
这是一份工程失效分析简报，适合练习因果链梳理与排除法阅读：先看作者如何用批次检测和显微图像逐一否定“缺陷电阻”“振动疲劳”两个假设，再抓出被保留的若干诱因。文中“contributing factors”与“no direct root cause”的区分、以及五条装配建议与各诱因的对应关系，都是同义替换和细节定位的好材料。
来源：NASA News · nasa.gov