NASA News·· 11 小時前精選推薦指數73.52
TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
TB 26-10 印刷電路板組件片式電阻本體開裂
導讀
For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]
NASA 技術簡報記錄了兩起片式電阻在振動後熱循環中開裂的案例，失效分析排除了批次缺陷和疲勞，認定電路板彎曲與安裝應力是主要誘因。簡報據此給出元件布局、焊點高度與熱衝擊測試等裝配建議。
推薦理由
這是一份工程失效分析簡報，適合練習因果鏈梳理與排除法閱讀：先看作者如何用批次檢測和顯微圖像逐一否定“缺陷電阻”“振動疲勞”兩個假設，再抓出被保留的若乾誘因。文中“contributing factors”與“no direct root cause”的區分、以及五條裝配建議與各誘因的對應關系，都是同義替換和細節定位的好材料。
來源：NASA News · nasa.gov